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柔性电子技术(英文)(FlexTech)(国际刊号)(OA期刊)

柔性电子技术(英文)(FlexTech)(国际刊号)(OA期刊)

基本信息
  • 主管单位:

  • 主办单位:

    清华大学

  • 国际刊号:

    2771-1706;EISSN 2771-1714

  • 国内刊号:

  • 学科分类:

    一般工业技术

  • 字数:

    -

  • 有无基金:

     

  • 周期:

    国际号刊-不明确

  • 特殊属性:

    外文期刊

联系信息
  • 电话:

    010-83470584(官网电话)

  • 邮箱:

    flextech@tup.tsinghua.edu.cn(官网邮箱)

  • 复合因子:

    0

  • 综合因子:

    0

  • 收录:

  • 级别:

期刊简介

《柔性电子技术》期刊已被查看:

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投稿指南

1、该刊只有国际刊号!

2、投稿方式:在线投稿。

3、官网网址:

https://onlinelibrary.wiley.com/journal/27711714

4、投稿系统:https://mc.manuscriptcentral.com/FlexTech

5、出刊日期:官方暂未公布刊期信息。

2024年2月26日星期一

投稿指南Author Guidelines

【官网信息】

Author Guidelines

Sections

Aims and Scope

Submission and Peer Review Process

Article Types

After Acceptance

1. Aims and Scope

FlexTech is a single-blind peer-reviewed, fully open access international journal co-published by Tsinghua University Press and Wiley, with the academic support provided by the Laboratory of Flexible Electronics Technology, Tsinghua University.

FlexTech aims at publishing experimental and theoretical research on flexible technologies with new materials, creative structures, original integrating strategies, innovative fabrication methods, and pioneering applications. FlexTech is the platform to gather and share inspiring findings and thoughts on emerging flexible technologies that act as the core and foundation for science and engineering.

The scope is internationally broad and interdisciplinary with emphases on fields including material science, electronics engineering, mechanics, physics, and chemistry. The journal recognizes the complexity of issues and therefore particularly welcomes innovative interdisciplinary research with wide impact. The scope includes but is not limited to the following:

Advanced materials for flexible devices; soft materials with unusual physical properties or functions; biomimetic soft materials.

Design of flexible, stretchable, and conformal structures for flexible devices; flexible structures with unconventional physical behaviors; three-dimensional electronics.

Novel fabrication, processing, and assembly techniques of flexible devices; large-scale manufacturing technologies of flexible systems and their core components.

Emerging applications of flexible technologies, e.g., biomedical engineering, healthcare, human–machine interface, Internet-of-Things.

Computational approaches and artificial intelligence for flexible technologies.

2. Submission and Peer Review Process

Thanks for your kind interest in FlexTech. The submissions have to consist of the content that has not been published or submitted for publication elsewhere except as a brief abstract in the proceedings of conferences or symposiums.

All the submissions will be handled and processed using the ScholarOne online submission system.

Once the submission materials have been prepared in accordance with the Author Guidelines, manuscripts should be submitted online at https://mc.manuscriptcentral.com/FlexTech

For help with submissions, please contact: flextech@tup.tsinghua.edu.cn

……

更多详情:

https://onlinelibrary.wiley.com/page/journal/27711714/homepage/author-guidelines

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