您当前位置：首页 > 国际期刊-MICROELECTRONICS INTERNATIONAL期刊投稿发表详细信息

MICROELECTRONICS INTERNATIONAL Q4

期刊收录：
SCIE
Scopus

基本信息

期刊ISSN：
1356-5362
期刊简拼：
MICROELECTRON INT
年发文章数：
30
E-ISSN：
Gold OA文章占比
1.10%
研究文章占比：
100.00%
是否OA：
Yes (Hybrid，可自选是否OA)
Jcr分区：
Q4
中科院分区：
4区

出版信息

出版商：
Emerald Group Publishing Ltd.
涉及研究方向：
工程技术-材料科学：综合
出版国家：
ENGLAND
出版语言：
English
出版周期：
Tri-annual
出版年份：
1982

2023-2024最新影响因子:0.7
自引率:0.00%
五年影响因子:0.7
JCI期刊引文指标:0.17
h-index:19
CiteScore:1.90

期刊关键词

4区 SCIE Scopus 工程技术 ENGINEERING ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE MULTIDISCIPLINARY 材料科学：综合

期刊简介

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.