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IEEE Transactions on Components Packaging and Manufacturing Technology Q2

期刊收录：
SCIE
Scopus

基本信息

期刊ISSN：
2156-3950
期刊简拼：
IEEE T COMP PACK MAN
年发文章数：
217
E-ISSN：
Gold OA文章占比
11.38%
研究文章占比：
98.16%
是否OA：
No
Jcr分区：
Q2
中科院分区：
3区

出版信息

出版商：
Institute of Electrical and Electronics Engineers Inc.
涉及研究方向：
ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
出版国家：
UNITED STATES
出版语言：
English
出版周期：
出版年份：
2011

2023-2024最新影响因子:2.3
自引率:13.00%
五年影响因子:2.1
JCI期刊引文指标:0.45
h-index:39
CiteScore:4.70

期刊关键词

2区 SCIE Scopus 工程技术 3区 ENGINEERING ELECTRICAL & ELECTRONIC 工程：电子与电气 MATERIALS SCIENCE MULTIDISCIPLINARY 材料科学：综合 MANUFACTURING 工程：制造

期刊简介

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

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期刊简写：IEEE T COMP PACK MAN

此期刊被最新的JCR期刊SCIE收录