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JOURNAL OF COMPUTING AND INFORMATION SCIENCE IN ENGINEERING

JOURNAL OF COMPUTING AND INFORMATION SCIENCE IN ENGINEERING Q2

  • 期刊收录:
  • SCIE
  • Scopus
基本信息
  • 期刊ISSN:

    1530-9827

  • 期刊简拼:

    J COMPUT INF SCI ENG

  • 年发文章数:

    99

  • E-ISSN:

  • Gold OA文章占比

    0.74%

  • 研究文章占比:

    98.99%

  • 是否OA:

    No

  • Jcr分区:

    Q2

  • 中科院分区:

    3区

出版信息
  • 出版商:

    American Society of Mechanical Engineers(ASME)

  • 涉及研究方向:

    工程技术-工程:制造

  • 出版国家:

    UNITED STATES

  • 出版语言:

    English

  • 出版周期:

    Quarterly

  • 出版年份:

  • 2023-2024最新影响因子:2.6
  • 自引率:15.40%
  • 五年影响因子:2.6
  • JCI期刊引文指标:0.55
  • h-index:45
  • CiteScore:6.30

期刊简介

The ASME Journal of Computing and Information Science in Engineering (JCISE) publishes articles related to Algorithms, Computational Methods, Computing Infrastructure, Computer-Interpretable Representations, Human-Computer Interfaces, Information Science, and/or System Architectures that aim to improve some aspect of product and system lifecycle (e.g., design, manufacturing, operation, maintenance, disposal, recycling etc.). Applications considered in JCISE manuscripts should be relevant to the mechanical engineering discipline. Papers can be focused on fundamental research leading to new methods, or adaptation of existing methods for new applications.

Scope: Advanced Computing Infrastructure; Artificial Intelligence; Big Data and Analytics; Collaborative Design; Computer Aided Design; Computer Aided Engineering; Computer Aided Manufacturing; Computational Foundations for Additive Manufacturing; Computational Foundations for Engineering Optimization; Computational Geometry; Computational Metrology; Computational Synthesis; Conceptual Design; Cybermanufacturing; Cyber Physical Security for Factories; Cyber Physical System Design and Operation; Data-Driven Engineering Applications; Engineering Informatics; Geometric Reasoning; GPU Computing for Design and Manufacturing; Human Computer Interfaces/Interactions; Industrial Internet of Things; Knowledge Engineering; Information Management; Inverse Methods for Engineering Applications; Machine Learning for Engineering Applications; Manufacturing Planning; Manufacturing Automation; Model-based Systems Engineering; Multiphysics Modeling and Simulation; Multiscale Modeling and Simulation; Multidisciplinary Optimization; Physics-Based Simulations; Process Modeling for Engineering Applications; Qualification, Verification and Validation of Computational Models; Symbolic Computing for Engineering Applications; Tolerance Modeling; Topology and Shape Optimization; Virtual and Augmented Reality Environments; Virtual Prototyping

《JOURNAL OF COMPUTING AND INFORMATION SCIENCE IN ENGINEERING》期刊已被查看:
期刊简写:J COMPUT INF SCI ENG

此期刊被最新的JCR期刊SCIE收录

期刊信息

  • 通讯地址
  • ASME-AMER SOC MECHANICAL ENG, THREE PARK AVE, NEW YORK, USA, NY, 10016-5990
  • 中国科学院《国际期刊预警名单(试行)》名单
  • 2024年02月发布的2024版:不在预警名单中
    2023年01月发布的2023版:不在预警名单中
    2021年12月发布的2021版:不在预警名单中
    2020年12月发布的2020版:不在预警名单中
    此期刊被最新的JCR期刊SCIE收录
  • 审稿速度
  • 收录数据库
  • 是否oa
  • 研究方向
  • >12周,或约稿
  • SCIE,Scopus
  • No
  • 工程技术-工程:制造

分区信息

中科院分区
  • 大类学科
  • 分区
  • 小类学科
  • Top期刊
  • 综述期刊
  • 工程技术
  • 3区
  • COMPUTER SCIENCE
    INTERDISCIPLINARY APPLICATIONS
    计算机:跨学科应用
    ENGINEERING
    MANUFACTURING
    工程:制造
WOS分区等级:2区
  • 版本
  • 按学科
  • 分区
  • 影响因子
  • WOS期刊SCI分(2023-2024年最新版)
  • COMPUTER SCIENCE
    INTERDISCIPLINARY APPLICATIONS
    ENGINEERING
    MANUFACTURING
  • Q2
  • 2.6
IF值(影响因子)趋势图
年发文量趋势图
自引率趋势图
中科院分区

常见问题

  • sci四区价格多少算合理?

     一篇sci4区是sci里最便宜的了 价格一般在3-4左右,如果有人告诉你几k就能发或者五位数出头,个人建议谨慎一点,不能因为贪小便宜吃大亏如果四区就能满足学